Chae Young Sim

Interests

Computer Architecture, Dynamic Thermal Management, Thermal Modeling

Ph.D. in Computer Science and Engineering, 2025 –
Korea University
SoC & Microprocessor Research Lab
Advisor: Professor Sung Woo Chung

B.S. in Computer Science and Engineering, 2025
Korea University

2025

Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs

J.Y. Lee*, C.Y. Sim*, S.H. Choi, S.W. Chung

IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2025

*Equal contribution

Performance Comparison of Heterogeneous Cores in Mobile APs under Thermal Constraints

C.Y. Sim, J.Y. Lee, S.W. Chung

Korea Computer Congress (KCC), 2025

Domestic conference